From November 20 to 24, 2026, the Trützschler Group will present its latest fiber processing technologies at ITMA Asia in Shanghai, China. Visitors are invited to meet our experts in Hall 5.1, Booth D20 and discover solutions designed to increase productivity, simplify operations and support greater efficiency across spinning preparation and nonwoven production.
Key highlights include the automated can transport system T-CAN, the next-generation card TC 30, innovative card clothing solutions such as STEELTOP and SUPERFLOW, as well as advanced nonwoven technologies for hygiene, wipes and filtration applications.
Trützschler Spinning
At ITMA Asia 2026, Trützschler Spinning will showcase technologies that help spinning mills increase productivity, improve operational efficiency and make better use of valuable raw materials.
A key highlight will be T-CAN, Trützschler’s automated can transport system. Designed to reduce labor dependency and support greater automation in spinning mills, T-CAN automates sliver transport throughout spinning preparation.
It connects cards and drawing passages while ensuring reliable material allocation. By reducing manual handling and supporting continuous production, the system helps lower labor requirements, minimize downtime and improve operational efficiency.
Read More: T-CAN Automation Transforms Sliver Can Transport at Trützschler
Visitors will also have the opportunity to learn more about the next-generation card TC 30. Customers achieve up to 40% higher productivity in man-made fiber applications while maintaining or even improving yarn quality.
The TC 30 is also equipped with a sophisticated waste suction system that enables the separate collection of different waste types, allowing more than 50% of card waste to be reused in a high-quality manner.
Combined with the proven WASTECONTROL system, the machine helps minimize unnecessary fiber loss and improve raw material utilization.
Trützschler Card Clothing
Trützschler Card Clothing will showcase its latest innovations for spinning and nonwovens, with a special focus on STEELTOP and SUPERFLOW.
STEELTOP, the all-steel flat top, offers more than twice the lifetime of conventional solutions while maintaining excellent sliver and yarn quality.
For nonwovens, SUPERFLOW reduces fiber buildup and supports stable, high-productivity operation.
Visitors can also discover FBC (Flexible Bend Control), the automated carding gap adjustment system, and the GX SeedClean cylinder wire series for enhanced cleaning performance and improved yarn quality.
Trützschler Nonwovens
Trützschler Nonwovens will showcase advanced solutions for the efficient and flexible production of hygiene, wipes and filtration nonwovens.
A key highlight is the new ATB (Air-Through-Bonding) Oven, designed for applications ranging from topsheets, backsheets, and acquisition and distribution layers (ADLs) for diapers and hygiene products to medical products and filtration media.
Its advanced air-through technology provides gentle and uniform heat distribution and homogeneous airflow across the web, supporting high process efficiency even at high production speeds.
Visitors can also learn more about Trützschler Nonwovens’ proven technologies for pulp-based nonwovens, including WLS (Wet-Laid/Spunlace) for flushable products and Carded/Pulp (CP) for premium wipes.
Building on these established technologies, flexible CPC (Carded/Pulp/Carded), CAC (Carded/Airlaid/Carded) and SPC (Spunbond/Pulp/Carded) configurations open up a broad range of possibilities for premium wipes and hygiene products.
This versatility enables manufacturers to tailor product structures to specific application and market requirements while benefiting from Trützschler’ comprehensive process expertise.
Read more: Trützschler Nonwovens: Industrialisation Is the Next Test for Sustainable Materials
Meet us in Shanghai!
ITMA Asia 2026 is your opportunity to discover Trützschler’s latest innovations for modern fiber processing.
Our experts from Spinning, Card Clothing and Nonwovens look forward to welcoming you at Booth D20 in Hall 5.1.
